SMT 2D AOI Equipment

  • Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly improve detection results.
  • High-precision motion system ensures stop-and-go accuracy under high-speed movement
  • Silk screen interference removal algorithm to remove positioning caused by silk screen interference
  • Can be connected to the integrated MES system according to factory needs
  • Powerful SPC software provides rich and accurate data statistics for online 2D AOI in SMT lines.
  • One-piece casting provides a high rigidity platform ideal for 2D AOI systems.
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Product Details

Funciones de potencia de IA

Powerful AI reasoning function and super AI computing power, supporting multi-graphics card expansion, are characteristic features of China’s 2D Automatic Optical Inspection systems. These systems offer processing speeds tens of times faster than traditional CPU methods.

Verdadera detección 3D

1、Small Angle 4-way digit projection system,  eliminate small spacing occlusion to a greater extent, 8-way digit projection option.

2、Breakthrough Morie fringe algorithm to further reduce CT time.

Defectos Comunes

  • Tombstoning 
  • Short circuit
  • Extra component
  • Excess solder
  • No solder
  • Billboarding
  • Print leakage
  • Skew
  • insufficient solder
  • Rotation
  • Material extraño

Defectos detectables de la IA

Parámetros técnicos

SerieAlpha Z510TBAlpha X510TB
Tipodual-sided single-Lane
Visual systemImágenes1000W,Optional:1500W/2000W1200W,Optional:2100W
2D/3D2D3D
 Resolution10μm/15μm
Inspect Speed27cm²/s  20cm²/s   48cm²/s   
 illuminationLED RGBW
HardwareFuente de alimentación200V-230V AC 50/60Hz
Fuerza3KW
Presión del aire0.4-0.6MPa
Peso1150KG
dimensionW1000*D1640*H1910
Checking
Specifications
Tamaño de placa de circuito impreso50*50~510*460
Espesor0.6-6mm
Optional Function Inteligencia artificialCentro de formación de datos masivos de IA
Funciones auxiliaresRemote centralized rejudgement, bar code reading, OCR identification
articulo de INSPECCIONDefects types of componentsMissing parts, tombstone, side-standing, misalignment,
 extra parts, foreign objects, etc.
Missing parts, extra parts, misalignment, reverse, floating height, side-standing, foreign objects, oxidation pollution, etc.
Solder Joints InspectionExcessive solder, insufficient solder, unexposed pins, solder holes, copper leakage,
scratches on the board surface, board surface damage, etc.

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