Product Details
SAMPLE DETECTION INFORMATION.
DZ UV 3D imaging technology fully displays 3D information of UV glue, analyzing the profile, finding inflection points based on the transformation rate, analyzing neighboring information, locating the climbing glue position, and controlling the specific information of climbing glue.
Specialized equipment for transparent glue inspection, such as glue inspection machines in SMT lines, enhances traditional 3D inspection. The side-view 3D camera is the industry’s only solution that can guarantee 100% detection of QFN/IC pin soldering defects.
Parámetros técnicos
| Series products | Underfill 3D AOI（Single-Lane) | ||||
| Tipo | Double sided Single Lane | ||||
| Vision system | Imágenes | 2D：5M industrial cameras； 3D：DZ Micro-nano imaging system | |||
| Resolution | 7μm | ||||
| Camera lens | Lente telecéntrica | ||||
| Encendiendo | WRGBW LED | ||||
| Velocidad | 1cm²/2s | ||||
| Motion mechanism | movimiento XY | servomotor de CA | |||
| Track width adjustment | Auto / manual | ||||
| Flow to | Customizable | ||||
| Track height | 900±30mm | ||||
| Hardware | Fuente de alimentación | AC220V | |||
| Fuerza | 2.2KW | ||||
| Pressure | 0.4-0.6MPa | ||||
| Peso | 850—900KG | ||||
| Equipment size | W1080*D1510*H1580mm | ||||
| Check specifications | Substrate size | Default： X260*Y460mm；Customizable | |||
| Espesor | ≤6mm | ||||
| función opcional | Auxiliary function | Remote repair、Barcode reading、OCR recognition | |||
| Inspection items | Element defect detection | Missing chip、Tombstone、Sideward、Shift、Multiple pieces、Particle、Low solder… | |||
| Solder joint inspection | Excess solder、Low solder、Bridge、Lifted lead、Solder ball… | ||||
| Underfill | Climbing glue height detection | ||||
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粤公网安备44030002010933号
