WEBER 3D AOI

Wire bonding inspection equipment

  • High-density marble platform provides assurance for high-precision
  • Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results
  • The latest self-developed AAM absolute precision measurement system,accurately detects wire aluminum and wire bonding defects
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Product Details

3D DETECTION

  1. Having complete WB 3D imaging capability

  2. Multi-layer focusing function, infinite depth of field, clear imaging across the entire board

  3. Zero-negative sample AI detection, exclusive in the industry, complex appearance defect capability

AI detection system

Parámetros técnicos

SerieWB-3D
Vision systemImagineStandard:1200W;Optional:2100W/6500W
Relación de resolución2.7um/1.8um
FOV size11mm*8.25mm²
 IluminaciónLED RGBW
HardwareFuente de alimentación200v-230V AC 50/60Hz
 Fuerza2.2KW
 Pressure0.4-0.6MPa
 Peso1100kg
 Equipment sizeW1156*D1475*H1650mm
Check specifications Substrate size50*50~510*460mm
 PCB thickness0.6~6mm
 Measure height Components measurable up to a maximum height of 30mm
función opcionalInteligencia artificialAI Big Data Training Center
Auxiliary functionRemote centralized review, Barcode reading, OCR recognition
Inspection itemsInspection itemsBad wire arc, bad solder joints, oxidation pollution, foreign matter, scratches……

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