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<\/p>\n# DZ Ball Placement and Repair Machines Successfully Delivered On-Site<\/p>\n
On September 30, the ball placement machine and ball repair machine under DZ were officially delivered to the client site, and the equipment has smoothly entered the commissioning and pilot production phase.<\/p>\n
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The delivered ball placement machine utilizes the **G-Brush placement methodology** and is configured with an automated solder ball feeding mechanism, ensuring precise transfer of solder balls into stencil apertures as the brush moves. The machine supports strip substrates ranging from 50\u00d750 mm to 300\u00d7300 mm, and is fully compatible with both FLUX and solder paste printing processes to meet diverse customer production requirements.<\/p>\n
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The ball repair machine operates as an **integrated AOI inspection and ball repair platform**. Following ball placement, it executes full-field scanning of the substrate to inspect key criteria, including excess balls, missing balls, ball shift, ball pitch, abnormal balls, and ball diameter. For defect locations detected by the system, the machine deploys specialized dispensing needles, ball placement needles, and ball removal needles to conduct targeted repairs, followed by a secondary verification scan to ensure maximum production yield.<\/p>\n
Both machines support seamless **MES integration**, enabling automated logging of operational data, alarm histories, and production metrics. Combined with multi-level user privilege control, they fulfill rigorous factory-level information management needs. In addition, the equipment supports both offline and inline operational modes, allowing standalone performance or flexible integration into existing production lines.<\/p>\n
During the commissioning and trial production phases, DZ process and technical engineers are stationed on-site to ensure smooth ramp-up and production handover.<\/p>\n
### About DZ Group<\/p>\n
Founded in 2018 and headquartered in Shenzhen, DZ Matrix Group operates over 25,000 square meters of modern manufacturing and office facilities with a global workforce exceeding 260 employees. The company holds more than 70 patents and software copyrights, and has been recognized as a National High-Tech Enterprise, Specialized and Sophisticated “Little Giant” Enterprise, while achieving stringent international certifications including CE and UL.<\/p>\n
Focused on the pan-semiconductor domain, DZ Group delivers dedicated AI-powered quality inspection solutions. Its core equipment portfolio spans AI 2D\/3D AOI, 3D SPI, AVI, laser marking systems, and precision placement machines\u2014widely adopted across PCBA, PCB, Mini LED, semiconductor, and new energy high-end manufacturing. The company maintains manufacturing plants and R&D centers in Shenzhen, Zhuhai, Yangjiang, Nantong, Beijing, and Quanzhou, backed by a sales and service footprint covering more than 10 countries and regions globally.<\/p>\n
Leveraging the DZ Group industrial ecosystem, we also supply comprehensive advanced equipment including component six-sided inspection machines, wafer ball placement machines, wafer sorting systems, IGBT sorters, plasma cleaning systems, laser drilling machines, laser via-plugging machines, pin insertion machines, odd-form insertion equipment, and precision dispensing systems\u2014providing clients with end-to-end intelligent manufacturing capabilities.<\/p>\n
To learn more about our solder ball placement and repair process solutions, or to consult on equipment selection and line planning, welcome to contact the DZ process engineering team.<\/p>\n
Grupo DZ<\/p>\n
Hotline: [+86 400-0755-003](tel:+864000755003)<\/p>\n
Website: [www.dz-group.com<\/a>] \/ [www.dz-group.com.cn<\/a>]<\/p>\n Address: No. 9-101, Tianyang 5th Road, Dongfang Community, Songgang Subdistrict, Bao’an District, Shenzhen, China<\/p>","protected":false},"excerpt":{"rendered":" DZ successfully delivered its advanced solder ball placement and ball repair machines on-site for pilot production. Featuring G-Brush feeding, high-precision AOI scanning, targeted needle repair, and MES integration for high-yield semiconductor packaging.<\/p>","protected":false},"author":8,"featured_media":11374,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[131],"tags":[],"class_list":["post-11369","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-company-news"],"acf":[],"yoast_head":"\n