3D AOI (Automatic Optical Inspection) Equipment can accurately inspect and measure the height dimensions of devices on PCBs, and provide clear side view images of ICs and various devices. When detected automatically, the AOI Equipment automatically scans the PCB through the camera, collects images, and compares the tested solder joints with the qualified parameters in the database. After image processing, the defects on the PCB are inspected and displayed/marked by display or automatic marking. This seamless integration of AOI Equipment into the inspection process enhances accuracy and efficiency, ensuring that manufactured products meet rigorous quality standards.
The automatic 3D solder paste inspection system is a desktop fully automatic 3D solder paste inspection equipment designed for the SMT process, fully programmable and automatic. With the integration of AOI Equipment, it only takes a few minutes to check the whole circuit board, and the SPC result can be given. One such automatic 3D solder paste inspection system equipment can support multiple SMT production lines. This seamless combination of advanced technologies significantly enhances the efficiency and accuracy of the solder paste inspection process, ensuring high-quality PCB assemblies in the SMT production environment.