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SMT 2D AOI Equipment

  • Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly improve detection results.
  • High-precision motion system ensures stop-and-go accuracy under high-speed movement
  • Silk screen interference removal algorithm to remove positioning caused by silk screen interference
  • Can be connected to the integrated MES system according to factory needs
  • Powerful SPC software provides rich and accurate data statistics for online 2D AOI in SMT lines.
  • One-piece casting provides a high rigidity platform ideal for 2D AOI systems.
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Product Details

Power AI Functions

Powerful AI reasoning function and super AI computing power, supporting multi-graphics card expansion, are characteristic features of China’s 2D Automatic Optical Inspection systems. These systems offer processing speeds tens of times faster than traditional CPU methods.

True 3D detection

1、Small Angle 4-way digit projection system,  eliminate small spacing occlusion to a greater extent, 8-way digit projection option.

2、Breakthrough Morie fringe algorithm to further reduce CT time.

Common Defects

  • Tombstoning 
  • Short circuit
  • Extra component
  • Excess solder
  • No solder
  • Billboarding
  • Print leakage
  • Skew
  • insufficient solder
  • Rotation
  • Foreign material

Detectable defects of the AI

Technical Parameters

SeriesAlpha Z510TBAlpha X510TB
Typedual-sided single-Lane
Visual systemImaging1000W,Optional:1500W/2000W1200W,Optional:2100W
2D/3D2D3D
 Resolution10μm/15μm
Inspect Speed27cm²/s  20cm²/s   48cm²/s   
 illuminationRGBW LED
HardwarePower Supply200V-230V AC 50/60Hz
Power3KW
Air pressure0.4-0.6MPa
Weight1150KG
dimensionW1000*D1640*H1910
Checking
Specifications
PCB Size50*50~510*460
Thickness0.6-6mm
Optional Function Artificial IntelligenceAI mass data training center
Auxiliary functionsRemote centralized rejudgement, bar code reading, OCR identification
Inspection ItemDefects types of componentsMissing parts, tombstone, side-standing, misalignment,
 extra parts, foreign objects, etc.
Missing parts, extra parts, misalignment, reverse, floating height, side-standing, foreign objects, oxidation pollution, etc.
Solder Joints InspectionExcessive solder, insufficient solder, unexposed pins, solder holes, copper leakage,
scratches on the board surface, board surface damage, etc.

Line position

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