Product Details
Power AI Functions
Powerful AI reasoning function and super AI computing power, supporting multi-graphics card expansion, are characteristic features of China’s 2D Automatic Optical Inspection systems. These systems offer processing speeds tens of times faster than traditional CPU methods.
True 3D detection
1、Small Angle 4-way digit projection system, eliminate small spacing occlusion to a greater extent, 8-way digit projection option.
2、Breakthrough Morie fringe algorithm to further reduce CT time.
Common Defects
- Tombstoning
- Short circuit
- Extra component
- Excess solder
- No solder
- Billboarding
- Print leakage
- Skew
- insufficient solder
- Rotation
- Foreign material
Detectable defects of the AI
Technical Parameters
| Series | Alpha Z510TB | Alpha X510TB | |
| Type | dual-sided single-Lane | ||
| Visual system | Imaging | 1000W，Optional：1500W/2000W | 1200W，Optional：2100W |
| 2D/3D | 2D | 3D | |
| Resolution | 10μm/15μm | ||
| Inspect Speed | 27cm²/s | 20cm²/s 48cm²/s | |
| illumination | RGBW LED | ||
| Hardware | Power Supply | 200V-230V AC 50/60Hz | |
| Power | 3KW | ||
| Air pressure | 0.4-0.6MPa | ||
| Weight | 1150KG | ||
| dimension | W1000*D1640*H1910 | ||
| Checking Specifications | PCB Size | 50*50~510*460 | |
| Thickness | 0.6-6mm | ||
| Optional Function | Artificial Intelligence | AI mass data training center | |
| Auxiliary functions | Remote centralized rejudgement, bar code reading, OCR identification | ||
| Inspection Item | Defects types of components | Missing parts, tombstone, side-standing, misalignment, extra parts, foreign objects, etc. | Missing parts, extra parts, misalignment, reverse, floating height, side-standing, foreign objects, oxidation pollution, etc. |
| Solder Joints Inspection | Excessive solder, insufficient solder, unexposed pins, solder holes, copper leakage, scratches on the board surface, board surface damage, etc. | ||
Line position
粤ICP备2025434628号
粤公网安备44030002010933号