Underfill 3D AOI

Specialized equipment for transparent glue inspection

  • Achieved high-precision measurement of transparent glue;
  • Domestic pioneering Underfill glue detection equipment;
  • Special laser measurement kit, a micrometer-level measurement ultimate

solution.

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Product Details

SAMPLE DETECTION INFORMATION.

DZ UV 3D imaging technology, fully displaying 3D information of UV glue, analyzing the profile, finding inflection points based on the

transformation rate, analysing neighboring information, locating the climbing glue position, and controlling the specific information

of climbing glue.

traditional 3D inspection!!!

The side-view 3D camera is the industry’s only solution that can guarantee 100%

detection of QFN/IC pin soldering defects.

Technical Parameters

Series productsUnderfill 3D AOI(Single-Lane)
Type Double sided Single Lane

Vision system
Imaging2D:5M工业相机;  3D:DZ Micro-nano imaging system
Resolution7μm
Camera lensTelecentric lens
LightingWRGBW LED
Speed1cm²/2s
Motion mechanismXY motionAC servo motor
Track width adjustmentAuto / manual
Flow toCustomizable
Track height  900±30mm
HardwarePower SupplyAC220V
Power  2.2KW
Pressure  0.4-0.6MPa
Weight  850—900KG
Equipment sizeW1080*D1510*H1580mm

Check specifications
Substrate sizeDefault: X260*Y460mm;Customizable
Thickness  ≤6mm
Optional functionAuxiliary functionRemote repair、Barcode reading、OCR recognition

  Inspection items
Element defect detectionMissing chip、Tombstone、Sideward、Shift、Multiple pieces、Particle、Low solder…
Solder joint inspectionExcess solder、Low solder、Bridge、Lifted lead、Solder ball…
UnderfillClimbing glue height detection

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