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WEBER 3D AOI

WEBER 3D AOI is an advanced inspection equipment that combines high-precision three-dimensional imaging technology and advanced image processing algorithms. This equipment, including specialized capabilities for detecting wire bonding and wire bonding inspection equipment, is specially designed for all-round inspection of electronic components, PCB boards, and other electronic parts. It ensures that the quality of products on the production line reaches the highest standards.

Wire bonding inspection equipment

  • High-density marble platform provides assurance for high-precision
  • Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results
  • The latest self-developed AAM absolute precision measurement system,accurately detects wire aluminum and wire bonding defects
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Product Details

3D DETECTION

  1. Having complete WB 3D imaging capability, specifically tailored for equipment for detecting wire bonding, this advanced system excels in comprehensive inspection tasks.
  2. Multi-layer focusing function, infinite depth of field, clear imaging across the entire board

  3. Zero-negative sample AI detection, exclusive in the industry, complex appearance defect capability

AI detection system

Technical Parameters

SeriesWB-3D
Vision systemImagineStandard:1200W;Optional:2100W/6500W
Resolution Ratio2.7um/1.8um
FOV size11mm*8.25mm²
 IlluminationRGBW LED
HardwarePower Supply200v-230V AC 50/60Hz
 Power2.2KW
 Pressure0.4-0.6MPa
 Weight1100kg
 Equipment sizeW1156*D1475*H1650mm
Check specifications Substrate size50*50~510*460mm
 PCB thickness0.6~6mm
 Measure height Components measurable up to a maximum height of 30mm
Optional functionArtificial IntelligenceAI Big Data Training Center
Auxiliary functionRemote centralized review, Barcode reading, OCR recognition
Inspection itemsInspection itemsBad wire arc, bad solder joints, oxidation pollution, foreign matter, scratches……

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