Продукты

SMT AI 3D AOI Equipment

SMT AI 3D AOI Equipment It is mainly used in SMT (Surface Mount Technology) production lines to conduct efficient and accurate quality inspection of electronic components, PCB boards, etc. SMT AI 3D AOI Equipment can automatically process and analyze images and identify various subtle defects and anomalies, such as poor solder joint connections, misaligned components, missing components, etc.

Side camera AI 3D AOI

Side camera AI 3D AOI combines side-view cameras and artificial intelligence technology to provide highly accurate three-dimensional defect detection solutions for electronic manufacturing and assembly processes. This device captures side images of components or products through side-viewing cameras and uses AI algorithms for image analysis and processing to achieve accurate identification of subtle defects.

Underfill 3D AOI

Underfill 3D AOI  is a device based on optical principles to detect common defects encountered in welding production. AOI is a new type of testing technology that is emerging, but it is developing rapidly. Many manufacturers have launched AOI testing equipment.

БТИЗ АОИ

IGBT AOI is an automatic optical inspection equipment specially used to detect the quality of IGBT (Insulated Gate Bipolar Transistor) modules. As a key component in the field of power electronics, IGBT modules are widely used in inverters, electric vehicles, wind turbines, solar panels and other fields, so the detection of their quality is crucial.

WEBER 3D AOI

WEBER 3D AOI is an advanced inspection equipment that combines high-precision three-dimensional imaging technology and advanced image processing algorithms. This equipment is specially designed for all-round inspection of electronic components, PCB boards and other electronic parts, ensuring that the quality of products on the production line reaches the highest standards.

SMT AI 3D SPI AOI Equipment

SMT AI 3D SPI AOI Equipment is an advanced equipment that combines surface mount technology, artificial intelligence, three-dimensional solder paste inspection and automatic optical inspection. This equipment is mainly used in SMT production lines to conduct accurate and efficient quality inspection of electronic components, solder paste printing on PCB boards, and subsequent assembly processes.

SMT AI 2D AOI Equipment

SMT AI 2D AOI is a type of equipment with high-speed and high-precision detection capabilities, capable of completing the inspection of a PCB board in a very short time. Its most intelligent aspect lies in its ability to automatically learn and optimize detection algorithms, further enhancing the accuracy and efficiency of detection. Compared to traditional manual inspection, this equipment offers higher detection accuracy and efficiency, significantly reducing the risks of missing detections and false alarms.

DIP AI AOI Equipment (Pre wave soldering)

DIP AI AOI Equipment (Pre wave soldering) is an intelligent equipment specially designed for automatic optical inspection (AOI) of dual in-line package (DIP) components before wave soldering. The equipment combines advanced image processing technology and artificial intelligence algorithms to enable accurate and efficient quality inspection of DIP components prior to the wave soldering process.

DIP AI AOI Equipment(Post Wave Soldering)

DIP AI AOI Equipment (Pre wave soldering) is an intelligent equipment specially designed for automatic optical inspection (AOI) of dual in-line package (DIP) components before wave soldering. Before the DIP components are fed into the wave soldering machine, the layout, position, orientation of the components, and the preparation of the solder joints will be comprehensively checked. Through high-resolution cameras, the equipment can capture precise images of DIP components and use AI algorithms to perform in-depth analysis and comparison of the images.

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