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This equipment uses advanced inspection algorithms, which significantly improves the pass rate of the traditional 2D AOI (automatic optical inspection) algorithm, improves the efficiency and accuracy of the 2D Automatic Optical Inspection system, and represents PCBA Inspection Equipment (Printed Circuit Board Assembly Inspection) equipment) field of development. The system’s high-resolution camera can accurately identify hard-to-detect defects such as solder beads, gold surface scratches, and gold surface contamination, redefining the industry standard for automatic optical inspection of PCBs.
The equipment comes standard with a 12-megapixel high-definition camera to ensure that every inspection is clear and accurate. For customers with higher detection requirements, you can choose a 25-megapixel camera to meet the demand for ultimate clarity. By using the RGBW+ telecentric lens and excellent Z-axis design, even components with a height of 110 mm can be easily handled, and common defects such as side stand, short circuit and multi-chip problems can be easily captured.
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