2D AOI

The self-developed advanced AI intelligent algorithm increases the pass-through rate to more than 30% of the traditional AOI algorithm, improving efficiency and accuracy and representing the future direction of detection technology. The introduction of AI deep learning makes devices more intelligent. It can accurately identify difficult-to-detect defects such as tin beads, gold surface scratches, and gold surface contamination, redefining the industry’s inspection standards. The core equipment is a 12-megapixel high-definition camera to ensure that every inspection is clear and accurate. For higher detection requirements, a 25-megapixel camera is optional to meet customers’ ultimate clarity needs. With the RGBW+ telecentric lens and excellent Z-axis, no matter how high the component reaches, even 110mm, it can be handled perfectly. Various common defects such as side stands, short circuits, and multiple pieces can be easily captured.

SMT AI 2D AOI Equipment

SMT AI 2D AOI is a type of equipment with high-speed and high-precision detection capabilities, capable of completing the inspection of a PCB board in a very short time. Its most intelligent aspect lies in its ability to automatically learn and optimize detection algorithms, further enhancing the accuracy and efficiency of detection. Compared to traditional manual inspection, this equipment offers higher detection accuracy and efficiency, significantly reducing the risks of missing detections and false alarms.

DIP AI AOI Equipment (Pre wave soldering)

DIP AI AOI Equipment (Pre wave soldering) is an intelligent equipment specially designed for automatic optical inspection (AOI) of dual in-line package (DIP) components before wave soldering. The equipment combines advanced image processing technology and artificial intelligence algorithms to enable accurate and efficient quality inspection of DIP components prior to the wave soldering process.

DIP AI AOI Equipment(Post Wave Soldering)

DIP AI AOI Equipment (Pre wave soldering) is an intelligent equipment specially designed for automatic optical inspection (AOI) of dual in-line package (DIP) components before wave soldering. Before the DIP components are fed into the wave soldering machine, the layout, position, orientation of the components, and the preparation of the solder joints will be comprehensively checked. Through high-resolution cameras, the equipment can capture precise images of DIP components and use AI algorithms to perform in-depth analysis and comparison of the images.

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