Product Details
SAMPLE DETECTION INFORMATION.
DZ UV 3D imaging technology fully displays 3D information of UV glue, analyzing the profile, finding inflection points based on the transformation rate, analyzing neighboring information, locating the climbing glue position, and controlling the specific information of climbing glue.
Specialized equipment for transparent glue inspection, such as glue inspection machines in SMT lines, enhances traditional 3D inspection. The side-view 3D camera is the industry’s only solution that can guarantee 100% detection of QFN/IC pin soldering defects.
Технические параметры
| Series products | Underfill 3D AOI（Single-Lane) | ||||
| Тип | Double sided Single Lane | ||||
| Vision system | визуализация | 2D：5M industrial cameras； 3D：DZ Micro-nano imaging system | |||
| Resolution | 7μm | ||||
| Camera lens | Телецентрический объектив | ||||
| Осветительные приборы | WRGBW LED | ||||
| Скорость | 1cm²/2s | ||||
| Motion mechanism | XY движение | AC servo motor | |||
| Track width adjustment | Auto / manual | ||||
| Flow to | Customizable | ||||
| Track height | 900±30мм | ||||
| Аппаратное обеспечение | Источник питания | AC220V | |||
| Власть | 2.2KW | ||||
| Pressure | 0.4-0.6MPa | ||||
| Масса | 850—900KG | ||||
| Equipment size | W1080*D1510*H1580mm | ||||
| Check specifications | Substrate size | Default： X260*Y460mm；Customizable | |||
| Thickness | ≤6mm | ||||
| Дополнительная функция | Auxiliary function | Remote repair、Barcode reading、OCR recognition | |||
| Inspection items | Element defect detection | Missing chip、Tombstone、Sideward、Shift、Multiple pieces、Particle、Low solder… | |||
| Solder joint inspection | Excess solder、Low solder、Bridge、Lifted lead、Solder ball… | ||||
| Underfill | Climbing glue height detection | ||||
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