WEBER 3D AOI

WEBER 3D AOI is an advanced inspection equipment that combines high-precision three-dimensional imaging technology and advanced image processing algorithms. This equipment, including specialized capabilities for detecting wire bonding and wire bonding inspection equipment, is specially designed for all-round inspection of electronic components, PCB boards, and other electronic parts. It ensures that the quality of products on the production line reaches the highest standards.

Wire bonding inspection equipment

• High-density marble platform provides assurance for high-precision
• Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results
• The latest self-developed AAM absolute precision measurement system,accurately detects wire aluminum and wire bonding defects