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SMT 2D AOI Equipment

Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly improve detection results.
High-precision motion system ensures stop-and-go accuracy under high-speed movement
Silk screen interference removal algorithm to remove positioning caused by silk screen interference
Can be connected to the integrated MES system according to factory needs
Powerful SPC software provides rich and accurate data statistics for online 2D AOI in SMT lines.
One-piece casting provides a high rigidity platform ideal for 2D AOI systems.

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Product Details

Funciones de potencia de IA

Powerful AI reasoning function and super AI computing power, supporting multi-graphics card expansion, are characteristic features of China’s 2D Automatic Optical Inspection systems. These systems offer processing speeds tens of times faster than traditional CPU methods.

Verdadera detección 3D

1、Small Angle 4-way digit projection system, eliminate small spacing occlusion to a greater extent, 8-way digit projection option.

2、Breakthrough Morie fringe algorithm to further reduce CT time.

Defectos Comunes

Tombstoning
Short circuit
Extra component
Excess solder
No solder
Billboarding
Print leakage
Skew
insufficient solder
Rotation
Material extraño

Defectos detectables de la IA

Parámetros técnicos

Serie		Alpha Z510TB	Alpha X510TB
Tipo		dual-sided single-Lane
Visual system	Imágenes	1000W，Optional：1500W/2000W	1200W，Optional：2100W
	2D/3D	2D	3D
	Resolution	10μm/15μm
	Inspect Speed	27cm²/s	20cm²/s 48cm²/s
	illumination	LED RGBW
Hardware	Fuente de alimentación	200V-230V AC 50/60Hz
	Fuerza	3KW
	Presión del aire	0.4-0.6MPa
	Peso	1150KG
	dimension	W1000D1640H1910
Checking Specifications	Tamaño de placa de circuito impreso	5050~510460
	Espesor	0.6-6mm
Optional Function	Inteligencia artificial	Centro de formación de datos masivos de IA
	Funciones auxiliares	Remote centralized rejudgement, bar code reading, OCR identification
articulo de INSPECCION	Defects types of components	Missing parts, tombstone, side-standing, misalignment, extra parts, foreign objects, etc.	Missing parts, extra parts, misalignment, reverse, floating height, side-standing, foreign objects, oxidation pollution, etc.
	Solder Joints Inspection	Excessive solder, insufficient solder, unexposed pins, solder holes, copper leakage, scratches on the board surface, board surface damage, etc.

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